Semiconductor device power metallization layer with stress-relieving heat sink structure
US-11276624-B2 · Mar 15, 2022 · US
This page is not indexed by search engines while we improve data quality.
Heitzsch Olaf patents
Heitzsch Olaf is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Heitzsch Olaf |
| Total patents | 2 |
| First publication | Jun 17, 2021 |
| Latest publication | Mar 15, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/22 | 2 |
| H10W20/089 | 2 |
| H10W20/056 | 2 |
| H10W20/035 | 2 |
| H10W40/735 | 2 |