Method for preparing high-entropy alloy composites reinforced by diamond particles
US-11761063-B2 · Sep 19, 2023 · US
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Hei Hongjun patents
Hei Hongjun is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hei Hongjun |
| Total patents | 2 |
| First publication | Aug 17, 2023 |
| Latest publication | Sep 19, 2023 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Taiyuan Technology | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B22F1/18 | 2 |
| C22C26/00 | 2 |
| C23C14/35 | 2 |
| C22C1/101 | 2 |
| C22C1/1036 | 2 |