Integrated circuit packaging with conductive film
US-2026023136-A1 · Jan 22, 2026 · US
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Healey Natasha patents
Healey Natasha is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Healey Natasha |
| Total patents | 21 |
| First publication | Jul 22, 2021 |
| Latest publication | Jan 22, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit package with split die attach paddle
US-2025364376-A1 · Nov 27, 2025 · US
Lead frame designs for enhanced ic package and die robustness
US-2025309061-A1 · Oct 2, 2025 · US
Integrated circuit packaging with insulation structure to control gap height and die tilt
US-2025273546-A1 · Aug 28, 2025 · US
Laminated substrate packages configured for coupling to isolation transformers
US-2025201771-A1 · Jun 19, 2025 · US
Leadless transformer packages
US-2025182948-A1 · Jun 5, 2025 · US
Integrated transformer and ic packages
US-2025182950-A1 · Jun 5, 2025 · US
Leadframe-based integrated transformer packages
US-2025174611-A1 · May 29, 2025 · US
Package configuration for high voltage gate drivers with a transformer
US-2025140673-A1 · May 1, 2025 · US
Packaged current sensor integrated circuit
US-12163983-B2 · Dec 10, 2024 · US
Recent patents
Latest publications not already listed above.
High isolation current sensor
US-11800813-B2 · Oct 24, 2023 · US
Current sensor integrated circuits
US-11644485-B2 · May 9, 2023 · US
Current sensor integrated circuits
US-2023110671-A1 · Apr 13, 2023 · US
Packaged current sensor integrated circuit
US-2023060219-A1 · Mar 2, 2023 · US
Current sensor integrated circuits
US-11519939-B2 · Dec 6, 2022 · US
Current sensor integrated circuits
US-2021405092-A1 · Dec 30, 2021 · US
High isolation current sensor
US-2021376227-A1 · Dec 2, 2021 · US
Power module package and packaging techniques
US-11183436-B2 · Nov 23, 2021 · US
Current sensor integrated circuits
US-11150273-B2 · Oct 19, 2021 · US
Current sensor integrated circuits
US-2021223292-A1 · Jul 22, 2021 · US
Power module package and packaging techniques
US-2021225721-A1 · Jul 22, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Allegro Microsystems Llc | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01R15/207 | 11 |
| H10W90/811 | 9 |
| H10W74/00 | 7 |
| H10W90/756 | 7 |
| H10W70/429 | 7 |