Method and system for identifying structure of compound
US-2023251224-A1 · Aug 10, 2023 · US
Hayakawa Eisuke is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hayakawa Eisuke |
| Total patents | 15 |
| First publication | Feb 26, 2015 |
| Latest publication | Aug 10, 2023 |
Publications ranked by popularity score, then publication date.
US-2023251224-A1 · Aug 10, 2023 · US
US-11573201-B2 · Feb 7, 2023 · US
US-2021247360-A1 · Aug 12, 2021 · US
US-9972900-B2 · May 15, 2018 · US
US-9880262-B2 · Jan 30, 2018 · US
US-9705196-B2 · Jul 11, 2017 · US
US-9696417-B2 · Jul 4, 2017 · US
US-9543643-B2 · Jan 10, 2017 · US
US-9435883-B2 · Sep 6, 2016 · US
US-2016079674-A1 · Mar 17, 2016 · US
Latest publications not already listed above.
US-9236664-B2 · Jan 12, 2016 · US
US-2015260836-A1 · Sep 17, 2015 · US
US-2015255870-A1 · Sep 10, 2015 · US
US-2015226838-A1 · Aug 13, 2015 · US
US-2015057833-A1 · Feb 26, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Fujitsu Ten Ltd | 12 |
| Nippon Pillar Packing | 8 |
| Okinawa Inst Science & Tech School Corp | 3 |
| Hayakawa Eisuke | 1 |
| Okunaga Takeshi | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01Q13/206 | 7 |
| H01Q1/3233 | 7 |
| G01S13/931 | 6 |
| G01S13/345 | 6 |
| H01Q21/065 | 5 |