Method of manufacturing semiconductor structure including removing hard mask layer and dielectric material layer exposed by patterned photoresist layer
US-12525460-B2 · Jan 13, 2026 · US
Han Xiaofei is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Han Xiaofei |
| Total patents | 5 |
| First publication | Oct 3, 2017 |
| Latest publication | Jan 13, 2026 |
Publications ranked by popularity score, then publication date.
US-12525460-B2 · Jan 13, 2026 · US
US-2023025163-A1 · Jan 26, 2023 · US
US-10147806-B1 · Dec 4, 2018 · US
US-2018342602-A1 · Nov 29, 2018 · US
US-9780101-B1 · Oct 3, 2017 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L27/11521 | 3 |
| H01L29/66825 | 3 |
| H10D30/681 | 3 |
| H10D30/0411 | 3 |
| H10B41/30 | 3 |