Ceramic electronic component
US-12512263-B2 · Dec 30, 2025 · US
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Goitsuka Takuya patents
Goitsuka Takuya is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Goitsuka Takuya |
| Total patents | 9 |
| First publication | May 13, 2021 |
| Latest publication | Dec 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate
US-12183666-B2 · Dec 31, 2024 · US
Ceramic electronic component
US-2024321516-A1 · Sep 26, 2024 · US
Ceramic electronic component
US-2024282519-A1 · Aug 22, 2024 · US
Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board
US-12052821-B2 · Jul 30, 2024 · US
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate
US-2023144181-A1 · May 11, 2023 · US
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate
US-11574860-B2 · Feb 7, 2023 · US
Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board
US-2022183156-A1 · Jun 9, 2022 · US
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate
US-2021143092-A1 · May 13, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Murata Manufacturing Co | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/113 | 6 |
| H10W72/241 | 4 |
| H10W72/221 | 4 |
| H10W72/072 | 4 |
| H10W90/00 | 4 |