Semiconductor packages and methods of packaging semiconductor devices
US-9881863-B2 · Jan 30, 2018 · US
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Eng Kian Teng patents
Eng Kian Teng is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eng Kian Teng |
| Total patents | 4 |
| First publication | Dec 31, 2015 |
| Latest publication | Jan 30, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages and methods of packaging semiconductor devices
US-2017148722-A1 · May 25, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9589875-B2 · Mar 7, 2017 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2015380346-A1 · Dec 31, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Utac Headquarters Pte Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/47 | 4 |
| H10W99/00 | 4 |
| H10W90/756 | 4 |
| H10W90/754 | 4 |
| H10W90/752 | 4 |