Method for calibrating an ultrasonic bonding machine
US-11646291-B2 · May 9, 2023 · US
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Eacock Florian patents
Eacock Florian is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eacock Florian |
| Total patents | 4 |
| First publication | Oct 10, 2019 |
| Latest publication | May 9, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for Calibrating an Ultrasonic Bonding Machine
US-2020043883-A1 · Feb 6, 2020 · US
Method for Bonding an Electrically Conductive Element to a Bonding Partner
US-2019356098-A1 · Nov 21, 2019 · US
Arrangements and Method for Providing a Bond Connection
US-2019312008-A1 · Oct 10, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/5363 | 4 |
| H10W72/07141 | 4 |
| H01L2224/78343 | 3 |
| H01L24/78 | 3 |
| B06B2201/72 | 2 |