Redistribution layer contacting first wafer through second wafer
US-9754860-B2 · Sep 5, 2017 · US
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Drucker Mark patents
Drucker Mark is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Drucker Mark |
| Total patents | 2 |
| First publication | Aug 9, 2016 |
| Latest publication | Sep 5, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit assembly and method of making
US-9412644-B2 · Aug 9, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 2 |
| Qualcomm Switch Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P90/1922 | 2 |
| H10W10/181 | 2 |
| H10P90/1914 | 2 |
| H10W72/20 | 2 |
| H10D86/201 | 2 |