Chip, microfluidic device, and method for sorting target droplets
US-2026077351-A1 · Mar 19, 2026 · US
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Deng Lin patents
Deng Lin is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Deng Lin |
| Total patents | 17 |
| First publication | Sep 13, 2018 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip, microfluidic device, and method for sorting target droplets
US-12508589-B2 · Dec 30, 2025 · US
Vertical multi-function power delivery devices
US-2025309204-A1 · Oct 2, 2025 · US
Microfluidic chip, microfluidic device
US-2025041849-A1 · Feb 6, 2025 · US
Microwell array chip, use method therefor, and detection apparatus
US-2025033056-A1 · Jan 30, 2025 · US
Chip packaging structure and chip packaging method
US-2024351026-A1 · Oct 24, 2024 · US
Microfluidic chip, method of controlling flow velocity of fluid, and method of using microfluidic chip
US-2024326056-A1 · Oct 3, 2024 · US
Method for ai inspecting fastener loosening status and surveillance device therefor
US-2024227879-A1 · Jul 11, 2024 · US
Microfluidic chip, box device, microfluidic device
US-2023405587-A1 · Dec 21, 2023 · US
Device for driving a cell processing chip and method of driving a cell processing chip
US-2023347339-A1 · Nov 2, 2023 · US
Recent patents
Latest publications not already listed above.
Microfluidic chip and droplet separation method
US-11701659-B2 · Jul 18, 2023 · US
Image classification method and device
US-11586863-B2 · Feb 21, 2023 · US
Chip, microfluidic device, and method for sorting target droplets
US-2022339630-A1 · Oct 27, 2022 · US
Microfluidic chip and droplet separation method
US-2022168743-A1 · Jun 2, 2022 · US
Image Fusion Classification Method and Device
US-2021209426-A1 · Jul 8, 2021 · US
Method and system for extracting and classifying features of hyperspectral remote sensing image
US-10509984-B2 · Dec 17, 2019 · US
Method and system for extracting and classifying features of hyperspectral remote sensing image
US-2018260657-A1 · Sep 13, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Boe Technology Group Co Ltd | 10 |
| Beijing Boe Technology Dev Co Ltd | 9 |
| Univ Shenzhen | 4 |
| Nvidia Corp | 1 |
| Univ Beijing Jiaotong | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B01L2300/0816 | 9 |
| B01L2300/0864 | 8 |
| B01L3/502784 | 8 |
| B01L2200/027 | 7 |
| B01L3/502715 | 7 |