Method for producing conductive lines in an interconnect structure of a semiconductor chip
US-2026011605-A1 · Jan 8, 2026 · US
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Decoster Stefan patents
Decoster Stefan is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Decoster Stefan |
| Total patents | 9 |
| First publication | Jun 24, 2021 |
| Latest publication | Jan 8, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Interconnection structure for a semiconductor device
US-12451429-B2 · Oct 21, 2025 · US
Method of manufacturing an interconnection structure for a semiconductor device having a spacer separating first and second conductive lines
US-12381116-B2 · Aug 5, 2025 · US
Method for producing an interconnect via
US-2025029872-A1 · Jan 23, 2025 · US
Method for Forming an Interconnection Structure
US-2024170328-A1 · May 23, 2024 · US
Interconnection Structure for a Semiconductor Device
US-2023170255-A1 · Jun 1, 2023 · US
Interconnection Structure for a Semiconductor Device
US-2023170300-A1 · Jun 1, 2023 · US
Semiconductor fabrication method for producing nano-scaled electrically conductive lines
US-11264271-B2 · Mar 1, 2022 · US
Semiconductor Fabrication Method for Producing Nano-Scaled Electrically Conductive Lines
US-2021193512-A1 · Jun 24, 2021 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Imec Vzw | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 9 |
| H10W20/069 | 7 |
| H10W20/063 | 7 |
| H01L21/76877 | 7 |
| H10P50/71 | 6 |