Method for the electrical bonding of semiconductor components
US-11362061-B2 · Jun 14, 2022 · US
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De Wolf Ingrid patents
De Wolf Ingrid is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | De Wolf Ingrid |
| Total patents | 10 |
| First publication | Jun 25, 2015 |
| Latest publication | Jun 14, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for the electrical bonding of semiconductor components
US-2020402950-A1 · Dec 24, 2020 · US
Method of detecting manufacturing defects by thermal stimulation
US-10777471-B2 · Sep 15, 2020 · US
Method of detecting manufacturing defects by thermal stimulation
US-2020075431-A1 · Mar 5, 2020 · US
Method for aligning micro-electronic components
US-9799632-B2 · Oct 24, 2017 · US
Method for Aligning Micro-Electronic Components
US-2017186733-A1 · Jun 29, 2017 · US
Method for aligning micro-electronic components
US-9601459-B2 · Mar 21, 2017 · US
Method for Producing an Integrated Circuit Device with Enhanced Mechanical Properties
US-2017011956-A1 · Jan 12, 2017 · US
Method and device for inspection of a semiconductor device
US-2017005018-A1 · Jan 5, 2017 · US
Method for Aligning Micro-Electronic Components
US-2015179605-A1 · Jun 25, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Imec Vzw | 10 |
| Univ Leuven Kath | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/722 | 9 |
| H10W72/072 | 7 |
| H10W72/241 | 7 |
| H10W72/07231 | 6 |
| H10W72/952 | 6 |