On-chip dual-mode transmission line with spoof surface plasmon based on balun
US-12444820-B2 · Oct 14, 2025 · US
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Cui Tiejun patents
Cui Tiejun is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cui Tiejun |
| Total patents | 5 |
| First publication | Jan 7, 2021 |
| Latest publication | Oct 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
On-chip dual-mode transmission line with spoof surface plasmon based on balun
US-2024258672-A1 · Aug 1, 2024 · US
Direct radiation wireless digital communications system and method based on digital coding metamaterial
US-11165612-B2 · Nov 2, 2021 · US
Automatic data acquisition system based on low-insulation vibrating wire sensor
US-2021140796-A1 · May 13, 2021 · US
Direct radiation wireless digital communications system and method based on digital coding metamaterial
US-2021006441-A1 · Jan 7, 2021 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Southeast | 3 |
| China Inst Water Resources & Hydropower Res | 1 |
| Univ Southeast | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01Q19/06 | 2 |
| H04L25/0242 | 2 |
| H01Q19/10 | 2 |
| H04L1/0009 | 2 |
| H04L25/0202 | 2 |