Vertical non-volatile memory with low resistance source contact
US-12575101-B2 · Mar 10, 2026 · US
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Clampitt Darwin A patents
Clampitt Darwin A is listed as an inventor on 85 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Clampitt Darwin A |
| Total patents | 85 |
| First publication | Feb 18, 2020 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Memory Circuitry And Methods Used In Forming Memory Circuitry
US-2026068162-A1 · Mar 5, 2026 · US
Memory Arrays Comprising Strings Of Memory Cells
US-2026032912-A1 · Jan 29, 2026 · US
Integrated Circuitry And Methods Used In Forming Integrated Circuitry
US-2026032910-A1 · Jan 29, 2026 · US
Methods Used In Forming Memory Circuitry
US-2026031147-A1 · Jan 29, 2026 · US
Method for manufacturing a memory structure having stacked data lines and conductive structures on sides thereof
US-12513903-B2 · Dec 30, 2025 · US
Silicon retention for transistor formation
US-2025391445-A1 · Dec 25, 2025 · US
Memory device including conductive contacts and support structures
US-2025378857-A1 · Dec 11, 2025 · US
Memory device including concentric conductive contacts
US-2025380420-A1 · Dec 11, 2025 · US
Memory circuitry and methods used in forming memory circuitry
US-12490439-B2 · Dec 2, 2025 · US
Recent patents
Latest publications not already listed above.
Microelectronic devices including isolation structures with air gaps and related methods
US-2025359060-A1 · Nov 20, 2025 · US
Memory devices
US-2025343134-A1 · Nov 6, 2025 · US
Memory Circuitry And Methods Used In Forming Memory Circuitry
US-2025311217-A1 · Oct 2, 2025 · US
Electronic devices including support pillars in slot regions, and related memory devices, systems, and methods
US-12394481-B2 · Aug 19, 2025 · US
Microelectronic devices and related memory devices
US-12388012-B2 · Aug 12, 2025 · US
Semiconductor device including stacked data lines
US-2025081461-A1 · Mar 6, 2025 · US
Memory device including multiple decks of memory cells and pillars extending through the decks
US-2025071996-A1 · Feb 27, 2025 · US
Stacked deck interconnect structures for microelectronic devices and related methods
US-2025062230-A1 · Feb 20, 2025 · US
Corrugated tier support structure and replacement source interior channel poly metalized lateral contact flow
US-2025029924-A1 · Jan 23, 2025 · US
Memory device with segmented sgd drain
US-2025006261-A1 · Jan 2, 2025 · US
Memory device including multiple decks of memory cells and pillars extending through the decks
US-12167599-B2 · Dec 10, 2024 · US
Low resistance staircase rivet contact using metal-to-metal strap connection
US-2024379544-A1 · Nov 14, 2024 · US
Microelectronic devices including slot structures extending through pillar structures, and related memory devices
US-2024357820-A1 · Oct 24, 2024 · US
Contact formation for a memory device
US-2024357837-A1 · Oct 24, 2024 · US
Methods of forming microelectronic devices including voids neighboring conductive contacts, and related electronic systems
US-2024339357-A1 · Oct 10, 2024 · US
Memory Circuitry And Methods Used In Forming Memory Circuitry
US-2024315027-A1 · Sep 19, 2024 · US
Microelectronic devices including contact structures, and related memory devices, and electronic systems
US-2024304722-A1 · Sep 12, 2024 · US
Memory Circuitry And Methods Used In Forming Memory Circuitry
US-2024268118-A1 · Aug 8, 2024 · US
Microelectronic devices including voids neighboring conductive contacts, and related memory devices, electronic systems, and methods
US-12040223-B2 · Jul 16, 2024 · US
Electronic devices comprising memory pillars and dummy pillars including an oxide material, and related systems and methods
US-12041775-B2 · Jul 16, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 78 |
| Lodestar Licensing Group Llc | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.