Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer
US-12489048-B2 · Dec 2, 2025 · US
Chen Mei-Yen is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Mei-Yen |
| Total patents | 12 |
| First publication | Oct 11, 2018 |
| Latest publication | Dec 2, 2025 |
Publications ranked by popularity score, then publication date.
US-12489048-B2 · Dec 2, 2025 · US
US-2025301571-A1 · Sep 25, 2025 · US
US-2025006577-A1 · Jan 2, 2025 · US
US-2024170385-A1 · May 23, 2024 · US
US-11125224-B2 · Sep 21, 2021 · US
US-10962514-B2 · Mar 30, 2021 · US
US-10674769-B2 · Jun 9, 2020 · US
US-10359036-B2 · Jul 23, 2019 · US
US-2019063421-A1 · Feb 28, 2019 · US
US-2019056367-A1 · Feb 21, 2019 · US
Latest publications not already listed above.
US-2018347557-A1 · Dec 6, 2018 · US
US-2018289064-A1 · Oct 11, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Microjet Technology Co Ltd | 8 |
| Innolux Corp | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| F04B43/046 | 4 |
| G01N1/2273 | 4 |
| H10W90/701 | 3 |
| H10W74/117 | 3 |
| H10W70/65 | 3 |