Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
US-9548276-B2 · Jan 17, 2017 · US
This page is not indexed by search engines while we improve data quality.
Chen Jason patents
Chen Jason is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Jason |
| Total patents | 2 |
| First publication | Jan 21, 2016 |
| Latest publication | Jan 17, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Win Semiconductors Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0234 | 2 |
| H10W20/0242 | 2 |
| H10W20/425 | 2 |
| H10W20/033 | 2 |
| H10W20/049 | 2 |