System and method to improve package and 3DIC yield in underfill process
US-8945983-B2 · Feb 3, 2015 · US
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Chen Cing He patents
Chen Cing He is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Cing He |
| Total patents | 1 |
| First publication | Feb 3, 2015 |
| Latest publication | Feb 3, 2015 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/734 | 1 |
| H10W76/60 | 1 |
| H10W76/42 | 1 |
| H10W74/15 | 1 |
| H10W74/012 | 1 |