Modified polyethylene terephthalate copolyester and preparation method thereof
US-2025101171-A1 · Mar 27, 2025 · US
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Chen Chi-Lin patents
Chen Chi-Lin is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Chi-Lin |
| Total patents | 19 |
| First publication | Mar 17, 2015 |
| Latest publication | Mar 27, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Modified bismaleimide resin and preparation method thereof
US-2025092200-A1 · Mar 20, 2025 · US
Resin composition
US-2025066609-A1 · Feb 27, 2025 · US
Resin composition
US-2025066552-A1 · Feb 27, 2025 · US
Modified naphthol resin and preparation method thereof
US-2025011527-A1 · Jan 9, 2025 · US
Phosphorous flame retardant, product and manufacturing method thereof
US-2024417414-A1 · Dec 19, 2024 · US
Resin composition and manufacturing method thereof
US-2024400734-A1 · Dec 5, 2024 · US
Modified bismaleimide resin
US-2024174811-A1 · May 30, 2024 · US
Modified maleimide resin
US-2024174810-A1 · May 30, 2024 · US
Vinyl-containing aromatic alicyclic copolymer, resin composition and product thereof
US-2024158550-A1 · May 16, 2024 · US
Recent patents
Latest publications not already listed above.
Polyphenylene ether bismaleimide resin
US-2024059836-A1 · Feb 22, 2024 · US
Polymer resin and manufacturing method thereof
US-2023151145-A1 · May 18, 2023 · US
Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board
US-11639420-B2 · May 2, 2023 · US
Resin material and metal substrate
US-2023100370-A1 · Mar 30, 2023 · US
Polyphenylene ether resin modified with bismaleimide, method for producing the same, and substrate material for circuit board
US-2023091594-A1 · Mar 23, 2023 · US
Polyphenylene ether resin modified with benzoxazine, method for producing the same, and substrate material for circuit board
US-2023089728-A1 · Mar 23, 2023 · US
Method of calculating dielectric constant and dielectric loss of polymer material
US-11579109-B1 · Feb 14, 2023 · US
Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board
US-2021122879-A1 · Apr 29, 2021 · US
Photovoltaic module
US-8981209-B2 · Mar 17, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nan Ya Plastics Corp | 16 |
| Nanya Plastics Corp | 2 |
| Chan I-Min | 1 |
| Chen Chi-Lin | 1 |
| Au Optronics Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08G73/12 | 6 |
| C08G73/124 | 4 |
| C08G73/121 | 4 |
| C08G73/126 | 3 |
| B32B2307/204 | 3 |