Semiconductor package and method
US-12550737-B2 · Feb 10, 2026 · US
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Chang Hung-Pin patents
Chang Hung-Pin is listed as an inventor on 56 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chang Hung-Pin |
| Total patents | 56 |
| First publication | Jan 22, 2015 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIER
US-2025357234-A1 · Nov 20, 2025 · US
Semiconductor package and method
US-2025357367-A1 · Nov 20, 2025 · US
Forming shallow trench for dicing and structures thereof
US-2025343173-A1 · Nov 6, 2025 · US
Stress buffer in integrated circuit package and method
US-2025329666-A1 · Oct 23, 2025 · US
Seal rings in integrated circuit package and method
US-2025329669-A1 · Oct 23, 2025 · US
Semiconductor structure and manufacturing method thereof
US-2025285930-A1 · Sep 11, 2025 · US
Semiconductor structure with capping layer and manufacturing method thereof
US-2025233034-A1 · Jul 17, 2025 · US
Device package with heterogeneous die structures and methods of forming same
US-2024421111-A1 · Dec 19, 2024 · US
Die stitching for stacking architecture in semiconductor packages
US-2024421077-A1 · Dec 19, 2024 · US
Recent patents
Latest publications not already listed above.
Seal rings in integrated circuit package and method
US-2024413101-A1 · Dec 12, 2024 · US
Stress buffer in integrated circuit package and method
US-2024413097-A1 · Dec 12, 2024 · US
Forming shallow trench for dicing and structures thereof
US-2024413102-A1 · Dec 12, 2024 · US
Semiconductor device and manufacturing method thereof
US-2024379482-A1 · Nov 14, 2024 · US
Semiconductor structure and manufacturing method thereof
US-2024379374-A1 · Nov 14, 2024 · US
Semiconductor structure and manufacturing method thereof
US-12142485-B2 · Nov 12, 2024 · US
Semiconductor package and manufacturing method thereof
US-2024128218-A1 · Apr 18, 2024 · US
Semiconductor package and method
US-2024071947-A1 · Feb 29, 2024 · US
Semiconductor device and method of forming the same
US-2024063030-A1 · Feb 22, 2024 · US
Methods of Forming Packages and Resulting Structures
US-2023402429-A1 · Dec 14, 2023 · US
Semiconductor device and method
US-11688639-B2 · Jun 27, 2023 · US
Semiconductor structure and manufacturing method thereof
US-2023197464-A1 · Jun 22, 2023 · US
Semiconductor structure and manufacturing method thereof
US-2023069214-A1 · Mar 2, 2023 · US
Semiconductor structure and manufacturing method thereof
US-11594420-B1 · Feb 28, 2023 · US
System, structure, and method of manufacturing a semiconductor substrate stack
US-11004832-B2 · May 11, 2021 · US
Conductive vias in semiconductor packages and methods of forming same
US-10978346-B2 · Apr 13, 2021 · US
System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack
US-2020126953-A1 · Apr 23, 2020 · US
Semiconductor Device and Method
US-2020118879-A1 · Apr 16, 2020 · US
Conductive vias in semiconductor packages and methods of forming same
US-2020006143-A1 · Jan 2, 2020 · US
System, structure, and method of manufacturing a semiconductor substrate stack
US-10515933-B2 · Dec 24, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 47 |
| Taiwan Semiconductor Mfg | 8 |
| Wintek Corp | 1 |
| Taiwan Semicondutor Mfg Company Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 39 |
| H10W20/023 | 39 |
| H10W20/20 | 29 |
| H10W72/0198 | 25 |
| H10P54/00 | 24 |