Flip chip bonding onto a photonic integrated circuit
US-10816740-B2 · Oct 27, 2020 · US
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Caverley Michael patents
Caverley Michael is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Caverley Michael |
| Total patents | 1 |
| First publication | Oct 27, 2020 |
| Latest publication | Oct 27, 2020 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Elenion Tech Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 1 |
| H10W90/00 | 1 |
| H10W72/50 | 1 |
| H10W90/28 | 1 |
| G02B6/4274 | 1 |