Treatment of Graphite Structures for Use Crystal Growth System or Deposition System for Growing Silicon Carbide
US-2026092395-A1 · Apr 2, 2026 · US
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Bubel Simon patents
Bubel Simon is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bubel Simon |
| Total patents | 40 |
| First publication | Apr 7, 2020 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Supramolecular organometallic curable fluids to coat substrates with metal carbides
US-2026092375-A1 · Apr 2, 2026 · US
Coordination complex curable fluids to coat substrates with metal carbides
US-2026092377-A1 · Apr 2, 2026 · US
Two Component Chemical Mechanical Polishing
US-2026077448-A1 · Mar 19, 2026 · US
System to Reduce Induced Subsurface Damage in Separation of Semiconductor Workpieces
US-2026070158-A1 · Mar 12, 2026 · US
Large diameter silicon carbide wafers
US-2026071351-A1 · Mar 12, 2026 · US
System to Reduce Induced Subsurface Damage in Separation of Semiconductor Workpieces
US-2026070263-A1 · Mar 12, 2026 · US
Large diameter silicon carbide wafers
US-2026071350-A1 · Mar 12, 2026 · US
Grind wheel design for low edge-roll grinding
US-12533767-B2 · Jan 27, 2026 · US
Two component chemical mechanical polishing
US-12521840-B2 · Jan 13, 2026 · US
Recent patents
Latest publications not already listed above.
Off Axis Laser-Based Surface Processing Operations for Semiconductor Wafers
US-2026005025-A1 · Jan 1, 2026 · US
Ionic Slurry for Electrochemical Mechanical Polishing
US-2025357131-A1 · Nov 20, 2025 · US
Polishing Pad Assembly for Electrochemical Mechanical Polishing
US-2025353136-A1 · Nov 20, 2025 · US
Workpiece Surface Processing System for Semiconductor Wafers
US-2025357182-A1 · Nov 20, 2025 · US
Large diameter silicon carbide wafers
US-12473661-B2 · Nov 18, 2025 · US
Fill-In Planarization System and Method
US-2025336723-A1 · Oct 30, 2025 · US
Off Axis Laser-Based Surface Processing Operations for Semiconductor Wafers
US-2025316480-A1 · Oct 9, 2025 · US
Off axis laser-based surface processing operations for semiconductor wafers
US-12438001-B1 · Oct 7, 2025 · US
Two Component Chemical Mechanical Polishing
US-2025282022-A1 · Sep 11, 2025 · US
Additives for Grinding Semiconductor Workpieces
US-2025285873-A1 · Sep 11, 2025 · US
Grind Wheel Design for Low Edge-Roll Grinding
US-2025282016-A1 · Sep 11, 2025 · US
Disc Grinding for Semiconductor Wafers on Polishing System
US-2025282021-A1 · Sep 11, 2025 · US
Fill-in planarization system and method
US-12362237-B1 · Jul 15, 2025 · US
Large dimension silicon carbide single crystalline materials with reduced crystallographic stress
US-2025006491-A1 · Jan 2, 2025 · US
Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods
US-2024367348-A1 · Nov 7, 2024 · US
Large diameter silicon carbide wafers
US-2024352622-A1 · Oct 24, 2024 · US
Large dimension silicon carbide single crystalline materials with reduced crystallographic stress
US-12125701-B2 · Oct 22, 2024 · US
Reduced optical absorption for silicon carbide crystalline materials
US-2024344239-A1 · Oct 17, 2024 · US
Silicon carbide wafers with relaxed positive bow and related methods
US-12070875-B2 · Aug 27, 2024 · US
Large diameter silicon carbide wafers
US-12054850-B2 · Aug 6, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Wolfspeed Inc | 34 |
| Cree Inc | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C30B29/36 | 26 |
| H10D62/8325 | 12 |
| C30B23/02 | 12 |
| H10P14/2904 | 11 |
| H10P50/00 | 10 |