Process for hysteretic current-voltage mediated void-free superconformal and bottom-up filling
US-2024229282-A1 · Jul 11, 2024 · US
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Braun Trevor Michael patents
Braun Trevor Michael is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Braun Trevor Michael |
| Total patents | 1 |
| First publication | Jul 11, 2024 |
| Latest publication | Jul 11, 2024 |
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Major assignees
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| Assignee | Patents |
|---|---|
| Government Of The Us Secretary Of Commerce | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/47 | 1 |
| H10W20/023 | 1 |
| H10W20/0245 | 1 |
| H10W20/2125 | 1 |
| H10W20/0261 | 1 |