Bonding pad for thermocompression bonding, process for producing a bonding pad and component
US-9281280-B2 · Mar 8, 2016 · US
Borowsky David is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Borowsky David |
| Total patents | 1 |
| First publication | Mar 8, 2016 |
| Latest publication | Mar 8, 2016 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Bosch Gmbh Robert | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W99/00 | 1 |
| H10W90/734 | 1 |
| H10W72/07336 | 1 |
| H10W72/07332 | 1 |
| H10W72/07236 | 1 |