Device with laminated structure and method of manufacturing a laminated structure comprising dielectric layers
US-2025240871-A1 · Jul 24, 2025 · US
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Auchere David patents
Auchere David is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Auchere David |
| Total patents | 47 |
| First publication | Jan 15, 2015 |
| Latest publication | Jul 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-2025070081-A1 · Feb 27, 2025 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-12170262-B2 · Dec 17, 2024 · US
Electronic device
US-2024321809-A1 · Sep 26, 2024 · US
Voltage regulating device
US-12051681-B2 · Jul 30, 2024 · US
Integrated circuit package
US-2024038607-A1 · Feb 1, 2024 · US
Electronic device comprising a chip and at least one SMT electronic component
US-11756874-B2 · Sep 12, 2023 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-2023121780-A1 · Apr 20, 2023 · US
Electronic device comprising a chip and at least one smt electronic component
US-2023015669-A1 · Jan 19, 2023 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-11557566-B2 · Jan 17, 2023 · US
Recent patents
Latest publications not already listed above.
Electronic device comprising a chip and at least one SMT electronic component
US-11482487-B2 · Oct 25, 2022 · US
Chip packaging device and corresponding manufacturing method
US-2022301976-A1 · Sep 22, 2022 · US
Voltage regulating device
US-2022028844-A1 · Jan 27, 2022 · US
Electronic device comprising a chip and at least one smt electronic component
US-2021104457-A1 · Apr 8, 2021 · US
Electronic device comprising an electronic component mounted on a support substrate and assembly method
US-10897822-B2 · Jan 19, 2021 · US
Electronic device provided with an integrated conductor element and fabrication method
US-10879583-B2 · Dec 29, 2020 · US
Electronic device including at least one electronic chip and electronic package
US-10811349-B2 · Oct 20, 2020 · US
Electronic device comprising an electronic component mounted on a support substrate and assembly method
US-2020305283-A1 · Sep 24, 2020 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-2020227382-A1 · Jul 16, 2020 · US
Method for mounting component
US-2020196433-A1 · Jun 18, 2020 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-10643970-B2 · May 5, 2020 · US
Electronic device provided with an integrated conductor element and fabrication method
US-2020119430-A1 · Apr 16, 2020 · US
Electronic device provided with an integrated conductor element and fabrication method
US-10522899-B2 · Dec 31, 2019 · US
Insulating contacting spacer
US-2019214274-A1 · Jul 11, 2019 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-2019148334-A1 · May 16, 2019 · US
Electronic device with integrated circuit chip provided with an external electrical connection network
US-10257943-B2 · Apr 9, 2019 · US
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
US-10224306-B2 · Mar 5, 2019 · US
Electronic device including at least one electronic chip and electronic package
US-2019067180-A1 · Feb 28, 2019 · US
Electronic device provided with an integrated conductor element and fabrication method
US-10116037-B2 · Oct 30, 2018 · US
Electronic device provided with an integrated conductor element and fabrication method
US-2018309187-A1 · Oct 25, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Grenoble 2 | 35 |
| St Microelectronics Alps Sas | 15 |
| Stmicroelectronics (Grenoble 2) Sas | 10 |
| STMicroelectronics (Alps) SAS | 9 |
| St Microelectronics Int Nv | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 28 |
| H10W44/20 | 26 |
| H10W74/114 | 25 |
| H10W74/121 | 21 |
| H10W74/01 | 21 |