Packaged dies with metal outer layers extending from die back sides toward die front sides
US-11437276-B2 · Sep 6, 2022 · US
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Abdo David patents
Abdo David is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Abdo David |
| Total patents | 9 |
| First publication | Mar 20, 2018 |
| Latest publication | Sep 6, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Microelectronic components having integrated heat dissipation posts and systems including the same
US-10861764-B2 · Dec 8, 2020 · US
Packaged dies with metal outer layers extending from die back sides toward die front sides
US-2020335398-A1 · Oct 22, 2020 · US
Method of wafer dicing for wafers with backside metallization and packaged dies
US-10741446-B2 · Aug 11, 2020 · US
Microelectronic components having integrated heat dissipation posts and systems including the same
US-2019206759-A1 · Jul 4, 2019 · US
Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
US-10269678-B1 · Apr 23, 2019 · US
Method of wafer dicing for wafers with backside metallization and packaged dies
US-2019013242-A1 · Jan 10, 2019 · US
Air cavity packages and methods for the production thereof
US-2018082915-A1 · Mar 22, 2018 · US
Air cavity packages and methods for the production thereof
US-9922894-B1 · Mar 20, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nxp Usa Inc | 8 |
| Freescale Semiconductor Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/07331 | 9 |
| H01L2224/8384 | 7 |
| H10W90/736 | 6 |
| H10W72/884 | 5 |
| H10W72/352 | 5 |