Interconnect substrate and method of making the same
US-2025201718-A1 · Jun 19, 2025 · US
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Patent family 96004702
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 96004702 |
| Family type | — |
| Earliest priority | Dec 15, 2023 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2025201718A1 — Interconnect substrate and method of making the same |
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US2025201718A1 — Interconnect substrate and method of making the same (published Jun 19, 2025)
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