Interlayer for Resistivity Reduction in Metal Deposition Applications
US-2024194527-A1 · Jun 13, 2024 · US
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Patent family 91379897
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 91379897 |
| Family type | — |
| Earliest priority | Dec 7, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024194527A1 — Interlayer for Resistivity Reduction in Metal Deposition Applications |
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US2024194527A1 — Interlayer for Resistivity Reduction in Metal Deposition Applications (published Jun 13, 2024)
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