Etching composition and method of manufacturing integrated circuits using the same
US-2024059967-A1 · Feb 22, 2024 · US
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Patent family 89907469
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 89907469 |
| Family type | — |
| Earliest priority | Aug 18, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024059967A1 — Etching composition and method of manufacturing integrated circuits using the same |
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US2024059967A1 — Etching composition and method of manufacturing integrated circuits using the same (published Feb 22, 2024)
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