Silica particles, production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device
US-2025197229-A1 · Jun 19, 2025 · US
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Patent family 89379907
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 89379907 |
| Family type | — |
| Earliest priority | Jun 20, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2025197229A1 — Silica particles, production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device |
Representative publication
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US2025197229A1 — Silica particles, production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device (published Jun 19, 2025)
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