Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods
US-2025385205-A1 · Dec 18, 2025 · US
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Patent family 88975986
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 88975986 |
| Family type | — |
| Earliest priority | Jun 1, 2022 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2025385205A1 — Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods |
Representative publication
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US2025385205A1 — Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods (published Dec 18, 2025)
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