Slurry compositions for polishing metal layers, chemical mechanical polishing apparatuses using the same, and methods for fabricating semiconductor devices using the same
US-2023193080-A1 · Jun 22, 2023 · US
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Patent family 86767423
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 86767423 |
| Family type | — |
| Earliest priority | Dec 21, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023193080A1 — Slurry compositions for polishing metal layers, chemical mechanical polishing apparatuses using the same, and methods for fabricating semiconductor devices using the same |
Representative publication
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US2023193080A1 — Slurry compositions for polishing metal layers, chemical mechanical polishing apparatuses using the same, and methods for fabricating semiconductor devices using the same (published Jun 22, 2023)
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