Method of manufacturing semiconductor structure and semiconductor structure
US-2023187482-A1 · Jun 15, 2023 · US
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Patent family 86695041
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 86695041 |
| Family type | — |
| Earliest priority | Dec 13, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023187482A1 — Method of manufacturing semiconductor structure and semiconductor structure |
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US2023187482A1 — Method of manufacturing semiconductor structure and semiconductor structure (published Jun 15, 2023)
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