System and method for integrated circuit (ic) nanometer range interconnect fabrication
US-2023326840-A1 · Oct 12, 2023 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 86100122 |
| Family type | — |
| Earliest priority | Mar 23, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023326840A1 — System and method for integrated circuit (ic) nanometer range interconnect fabrication |
Best representative member for this family based on priority and filing country.
US2023326840A1 — System and method for integrated circuit (ic) nanometer range interconnect fabrication (published Oct 12, 2023)
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