3d volume inspection of semiconductor wafers with increased throughput and accuracy
US-2025022680-A1 · Jan 16, 2025 · US
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Patent family 86006625
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 86006625 |
| Family type | — |
| Earliest priority | Apr 7, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2025022680A1 — 3d volume inspection of semiconductor wafers with increased throughput and accuracy |
Representative publication
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US2025022680A1 — 3d volume inspection of semiconductor wafers with increased throughput and accuracy (published Jan 16, 2025)
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