Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and peeling and dissolving composition
US-2024132806-A1 · Apr 25, 2024 · US
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Patent family 85602922
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 85602922 |
| Family type | — |
| Earliest priority | Sep 16, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024132806A1 — Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and peeling and dissolving composition |
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US2024132806A1 — Method for cleaning semiconductor substrate, method for manufacturing processed semiconductor substrate, and peeling and dissolving composition (published Apr 25, 2024)
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