Semiconductor packages and method of forming the same
US-2025087627-A1 · Mar 13, 2025 · US
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Patent family 82531309
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 82531309 |
| Family type | — |
| Earliest priority | Mar 31, 2021 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2025087627A1 — Semiconductor packages and method of forming the same |
Representative publication
Best representative member for this family based on priority and filing country.
US2025087627A1 — Semiconductor packages and method of forming the same (published Mar 13, 2025)
Member publications
Related publications in this family.
Semiconductor packages and method of forming the same
US-12176321-B2 · Dec 24, 2024 · US
Semiconductor packages and method of forming the same
US-2022320039-A1 · Oct 6, 2022 · US