Method for manufacturing semiconductor structure and semiconductor structure
US-12002864-B2 · Jun 4, 2024 · US
This page is not indexed by search engines while we improve data quality.
Patent family 82219021
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 82219021 |
| Family type | — |
| Earliest priority | Jan 4, 2021 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12002864B2 — Method for manufacturing semiconductor structure and semiconductor structure |
Representative publication
Best representative member for this family based on priority and filing country.
US12002864B2 — Method for manufacturing semiconductor structure and semiconductor structure (published Jun 4, 2024)
Member publications
Related publications in this family.