Electrodeposited copper foil and copper clad laminate
US-11492718-B1 · Nov 8, 2022 · US
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Patent family 82198734
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 82198734 |
| Family type | — |
| Earliest priority | Jun 16, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US11492718B1 — Electrodeposited copper foil and copper clad laminate |
Representative publication
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US11492718B1 — Electrodeposited copper foil and copper clad laminate (published Nov 8, 2022)
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