Process for hysteretic current-voltage mediated void-free superconformal and bottom-up filling
US-2024229282-A1 · Jul 11, 2024 · US
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Patent family 82019446
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 82019446 |
| Family type | — |
| Earliest priority | May 12, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024229282A1 — Process for hysteretic current-voltage mediated void-free superconformal and bottom-up filling |
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US2024229282A1 — Process for hysteretic current-voltage mediated void-free superconformal and bottom-up filling (published Jul 11, 2024)
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