Method of making semiconductor device having a thermal contact
US-2025062179-A1 · Feb 20, 2025 · US
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Patent family 80790809
This patent family groups 7 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80790809 |
| Family type | — |
| Earliest priority | Nov 20, 2020 |
| First filing country | US |
| Member publications | 7 |
| Countries | US |
| Representative publication | US2025062179A1 — Method of making semiconductor device having a thermal contact |
Representative publication
Best representative member for this family based on priority and filing country.
US2025062179A1 — Method of making semiconductor device having a thermal contact (published Feb 20, 2025)
Member publications
Related publications in this family.
Semiconductor device having a thermal contact and method of making
US-12142542-B2 · Nov 12, 2024 · US
Method of making a semiconductor device having a thermal contact
US-12094799-B2 · Sep 17, 2024 · US
Thermal substrate contact
US-11862527-B2 · Jan 2, 2024 · US
Semiconductor device having a thermal contact and method of making
US-2023386958-A1 · Nov 30, 2023 · US
Method of making a semiconductor device having a thermal contact
US-2022384296-A1 · Dec 1, 2022 · US
Thermal substrate contact
US-2022165637-A1 · May 26, 2022 · US