Method of manufacturing semiconductor device and substrate processing apparatus
US-2022084813-A1 · Mar 17, 2022 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80476255 |
| Family type | — |
| Earliest priority | Sep 11, 2020 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2022084813A1 — Method of manufacturing semiconductor device and substrate processing apparatus |
Best representative member for this family based on priority and filing country.
US2022084813A1 — Method of manufacturing semiconductor device and substrate processing apparatus (published Mar 17, 2022)
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