Wiring substrate and method for manufacturing wiring substrate
US-11729912-B2 · Aug 15, 2023 · US
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Patent family 80114444
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80114444 |
| Family type | — |
| Earliest priority | Aug 6, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11729912B2 — Wiring substrate and method for manufacturing wiring substrate |
Representative publication
Best representative member for this family based on priority and filing country.
US11729912B2 — Wiring substrate and method for manufacturing wiring substrate (published Aug 15, 2023)
Member publications
Related publications in this family.
Wiring substrate and method for manufacturing wiring substrate
US-2022046795-A1 · Feb 10, 2022 · US