Vertical non-volatile memory device including thermoelectric device, semiconductor package including the memory device, and heat dissipation method of the memory device
US-12207463-B2 · Jan 21, 2025 · US
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Patent family 78086294
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78086294 |
| Family type | — |
| Earliest priority | Jan 27, 2021 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12207463B2 — Vertical non-volatile memory device including thermoelectric device, semiconductor package including the memory device, and heat dissipation method of the memory device |
Representative publication
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US12207463B2 — Vertical non-volatile memory device including thermoelectric device, semiconductor package including the memory device, and heat dissipation method of the memory device (published Jan 21, 2025)
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