Method for fabricating a semiconductor device comprising a paste layer and semiconductor device
US-11329021-B2 · May 10, 2022 · US
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Patent family 70470513
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 70470513 |
| Family type | — |
| Earliest priority | Nov 15, 2018 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11329021B2 — Method for fabricating a semiconductor device comprising a paste layer and semiconductor device |
Representative publication
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US11329021B2 — Method for fabricating a semiconductor device comprising a paste layer and semiconductor device (published May 10, 2022)
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