Method for disposal of waste printed circuit board thermal cracking slag and smelting soot
US-11692238-B2 · Jul 4, 2023 · US
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Patent family 70036562
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 70036562 |
| Family type | — |
| Earliest priority | Dec 25, 2019 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11692238B2 — Method for disposal of waste printed circuit board thermal cracking slag and smelting soot |
Representative publication
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US11692238B2 — Method for disposal of waste printed circuit board thermal cracking slag and smelting soot (published Jul 4, 2023)
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