Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same
US-10829690-B2 · Nov 10, 2020 · US
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Patent family 69642116
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 69642116 |
| Family type | — |
| Earliest priority | Aug 30, 2018 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10829690B2 — Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same |
Representative publication
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US10829690B2 — Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same (published Nov 10, 2020)
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