Method of fabricating a flip-chip package core substrate with build-up layers
US-12154866-B2 · Nov 26, 2024 · US
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Patent family 68464173
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 68464173 |
| Family type | — |
| Earliest priority | May 10, 2018 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12154866B2 — Method of fabricating a flip-chip package core substrate with build-up layers |
Representative publication
Best representative member for this family based on priority and filing country.
US12154866B2 — Method of fabricating a flip-chip package core substrate with build-up layers (published Nov 26, 2024)
Member publications
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Flip-chip packaging substrate and method for fabricating the same
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Flip-chip packaging substrate and method for fabricating the same
US-11476204-B2 · Oct 18, 2022 · US
Flip-chip packaging substrate and method for fabricating the same
US-2019348375-A1 · Nov 14, 2019 · US