Raw material for forming thin film by atomic layer deposition method and method for producing thin film
US-2021155638-A1 · May 27, 2021 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 68239586 |
| Family type | — |
| Earliest priority | Apr 20, 2018 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2021155638A1 — Raw material for forming thin film by atomic layer deposition method and method for producing thin film |
Best representative member for this family based on priority and filing country.
US2021155638A1 — Raw material for forming thin film by atomic layer deposition method and method for producing thin film (published May 27, 2021)
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