Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
US-12084599-B2 · Sep 10, 2024 · US
This page is not indexed by search engines while we improve data quality.
Patent family 66664642
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 66664642 |
| Family type | — |
| Earliest priority | Dec 1, 2017 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12084599B2 — Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material |
Representative publication
Best representative member for this family based on priority and filing country.
US12084599B2 — Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material (published Sep 10, 2024)
Member publications
Related publications in this family.
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
US-2024093059-A1 · Mar 21, 2024 · US
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
US-11840648-B2 · Dec 12, 2023 · US
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
US-2020399506-A1 · Dec 24, 2020 · US