Semiconductor package including interposer
US-2025070032-A1 · Feb 27, 2025 · US
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Patent family 65724176
This patent family groups 9 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 65724176 |
| Family type | — |
| Earliest priority | Jul 31, 2018 |
| First filing country | US |
| Member publications | 9 |
| Countries | US |
| Representative publication | US2025070032A1 — Semiconductor package including interposer |
Representative publication
Best representative member for this family based on priority and filing country.
US2025070032A1 — Semiconductor package including interposer (published Feb 27, 2025)
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